部品番号
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仕様
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データ
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SAM-980-2-x-500fs
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SAM: l = 980 nm, 吸収率 2 %, t ~ 500 fs
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SAM-980-3-x-500fs
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SAM: l = 980 nm, 吸収率 3 %, t ~ 500 fs
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SAM-980-4-x-500fs
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SAM: l = 980 nm, 吸収率 4 %, t ~ 500 fs
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SAM-980-15-x-500fs
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SAM: l = 980 nm, 吸収率 15 %, t ~ 500 fs
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SAM-980-20-x-500fs
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SAM: l = 980 nm, 吸収率 20 %, t ~ 500 fs
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SAM-980-30-x-500fs
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SAM: l = 980 nm, 吸収率 30 %, t ~ 500 fs
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SAM-980-50-x-500fs
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SAM: l = 980 nm, 吸収率 50 %, t ~ 500 fs
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部品番号
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仕様
|
データ
|
SAM-980-2-x-t
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Saturable Absorber Mirror, 動作波長 980 nm, 吸収率 2 %
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SAM-980-2-0-t
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unmounted chip, 面積: 4 mm x 4 mm, 厚さ: 400 µm
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SAM-980-2-0-t
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unmounted chip, 面積: 1 mm x 1 mm or 1.3 mm x 1.3 mm,
厚さ: 400 µm, ファイバーレーザの突き合わせ結合用, 5 個/set |
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SAM-980-2-7 t-t
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mounted: thin film soldered on a W/Cu heat sink with 7mm x 7mm x 1mm
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SAM-980-2-12.7 g-t
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mounted: glued on a gold plated Cu-cylinder with 12.7 mm Ø
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SAM-980-2-25.0 g-t
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mounted: glued on a gold plated Cu-cylinder with 25.0 mm Ø
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SAM-980-2-25.4 g-t
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mounted: glued on a gold plated Cu-cylinder with 25.4 mm Ø
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SAM-980-2-12.7 s-t
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mounted: soldered on a gold plated Cu-cylinder with 12.7 mm Ø
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SAM-980-2-25.0 s-t
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mounted: soldered on a gold plated Cu-cylinder with 25.0 mm Ø
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SAM-980-2-25.4 s-t
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mounted: soldered on a gold plated Cu-cylinder with 25.4 mm Ø
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SAM-980-2-25.0 w-t
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mounted: soldered on a water cooled Cu-cylinder with 25.0 mm Ø
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SAM-980-2-25.0 h-t
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mounted: Thin film soldered SAM on W/Cu submount,
glued with silver epoxy on a water cooled copper heat sink with 25.0 mm diameter for high power applications |
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SAM-980-2-FC/PC-t
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mounted on a 1 m SM ファイバー FC/PC 付き、またはその他のコネクタ対応
在庫: HI 980 (Corning),HI 1060 (Corning), 1060 XP (Nufern), PM 980 HP (Panda) |