部品番号
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仕様
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データ
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SAM-940-4-x-1ps
|
SAM: l = 940 nm, 吸収率 4 %
|
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SAM-940-5-x-1ps
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SAM: l = 940 nm, 吸収率 5 %
|
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SAM-940-6-x-1ps
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SAM: l = 940 nm, 吸収率 6 %
|
|
SAM-940-30-x-1ps
|
SAM: l = 940 nm, 吸収率 30 %
|
部品番号
|
仕様
|
データ
|
SAM-940-4-x-t
|
Saturable Absorber Mirror, 動作波長 940 nm, 吸収率 4 %
|
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SAM-940-4-0-t
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unmounted chip, 面積: 4 mm x 4 mm, 厚さ: 400 µm
|
|
SAM-940-4-0-t
|
unmounted chip, 面積: 1 mm x 1 mm or 1.3 mm x 1.3 mm,
厚さ: 400 µm, ファイバーレーザの突き合わせ結合用, 5 個/set |
|
SAM-940-4-7 t-t
|
mounted: thin film soldered on a W/Cu heat sink with dimensions 7mm x 7mm x 1mm
|
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SAM-940-4-12.7 g-t
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mounted: glued on a gold plated Cu-cylinder with 12.7 mm Ø
|
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SAM-940-4-25.0 g-t
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mounted: glued on a gold plated Cu-cylinder with 25.0 mm Ø
|
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SAM-940-4-25.4 g-t
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mounted: glued on a gold plated Cu-cylinder with 25.4 mm Ø
|
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SAM-940-4-12.7 s-t
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mounted: soldered on a gold plated Cu-cylinder with 12.7 mm Ø
|
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SAM-940-4-25.0 s-t
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mounted: soldered on a gold plated Cu-cylinder with 25.0 mm Ø
|
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SAM-940-4-25.4 s-t
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mounted: soldered on a gold plated Cu-cylinder with 25.4 mm Ø
|
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SAM-940-4-25.0 w-t
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mounted: soldered on a water cooled Cu-cylinder with 25.0 mm Ø
|
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SAM-940-4-25.0 h-t
|
mounted: Thin film soldered SAM on W/Cu submount,
glued with silver epoxy on a water cooled copper heat sink with 25.0 mm diameter for high power applications |
|
SAM-940-4-FC/PC-t
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mounted on a 1 m SMファイバー FC/PC 付き またはその他のコネクタ対応
在庫ファイバー: HI 980 (Corning), HI 1060 (Corning),1060 XP (Nufern), PM 980 HP (Panda) |